PENGARUH PENAMBAHAN TEMBAGA (Cu) TERHADAP SIFAT LISTRIK POLIANILIN (PANi)

Authors

  • Astuti Astuti Laboratorium Fisika Material. Jurusanan Fisika. Universitas Andalas, Indonesia

DOI:

https://doi.org/10.25077/jif.5.1.31-37.2013

Abstract

Penelitian ini bertujuan untuk menganalisis pengaruh penambahan serbuk tembaga (Cu) terhadap nilai konduktivitas dan energi gap PANi-Cu. Pengukuran konduktivitas ini dilakukan dengan variasi suhu yaitu 298 K dan 373 K. Kenaikan suhu pada saat pengukuran menyebabkan peningkatan konduktivitas bahan tersebut. Konduktivitas pada suhu tertinggi yaitu 373 K dengan konduktivitas antara 4,46 x 10-4 S/cm - 8,92 x 10-4 S/cm untuk semua variasi konsentrasi serbuk tembaga yaitu 0,1; 0,3, dan 0,5 gr. Berbanding terbalik dengan energi gap, yaitu semakin banyak komposisi serbuk tembaga yang ditambahkan mengakibatkan penurunan energi gap pada komposit PANi-Cu. Nilai energi gap yang dihasilkan adalah 0,32-0,8 eV untuk semua variasi doping tembaga terhadap PANi.

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Published

2013-03-25

How to Cite

Astuti, A. (2013). PENGARUH PENAMBAHAN TEMBAGA (Cu) TERHADAP SIFAT LISTRIK POLIANILIN (PANi). JURNAL ILMU FISIKA | UNIVERSITAS ANDALAS, 5(1), 31–37. https://doi.org/10.25077/jif.5.1.31-37.2013

Issue

Vol. 5 No. 1 (2013): March 2013

Section

Riset Artikel

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