Pengaruh Lama Penumbuhan Titanium Dioksida Didoping Copper Terhadap Energi Gap

Authors

  • Ade Usra Berli
  • Dahyunir Dahlan
  • Akrajas Ali Umar

DOI:

https://doi.org/10.25077/jif.8.2.60-63.2016

Abstract

Deposisi lapisan TiO2 didoping Cu telah berhasil ditumbuhkan dengan menggunakan metoda Liquid Phase Deposition (LPD). Lapisan TiO2-Cu dibuat dengan menggunakan material Ammonium hexafluorotitanate ((NH4)2TiF6), Copper (II) Nitrate hydrate (Cu(NO3)2·xH2O), dan Hexamethylen tetramine (C6H12N4). Dalam penelitian ini dilakukan variasi lama penumbuhan lapisan yaitu 3 jam, 5 jam, 7 jam dan 10 jam. Lapisan TiO2-Cu dikarakterisasi menggunakan Spektrometri Ultraviolet-Visible (UV-Vis) untuk menentukan energi gap melalui spektra difusi reflektansi. Hasil energi gap yang diperoleh pada lapisan TiO2-Cu dengan variasi lama penumbuhan yaitu antara 3,26-3,30 eV.

Kata kunci: Titanium dioksida (TiO2), Liquid Phase Deposition (LPD) dan doping

 

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How to Cite

Berli, A. U., Dahlan, D., & Umar, A. A. (2017). Pengaruh Lama Penumbuhan Titanium Dioksida Didoping Copper Terhadap Energi Gap. JURNAL ILMU FISIKA, 8(2), 60–63. https://doi.org/10.25077/jif.8.2.60-63.2016

Issue

Vol. 8 No. 2 (2016): September 2016

Section

Research Article

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